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Multilayer ceramic capacitors
Chip, HQF
Series/Type: Date:
Chip February 2009
The following products presented in this data sheet are being withdrawn. Substitute Products: See www.epcos.com/withdrawal_mlcc Ordering Code B37923K5100J070 B37923K5120J060 B37923K5120J070 Substitute Product Date of Withdrawal 2009-06-26 2009-06-26 2009-06-26 Deadline Last Orders 2010-06-30 2010-06-30 2010-06-30 Last Shipments 2010-12-31 2010-12-31 2010-12-31
(c) EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Ordering Code B37933K5000B460 B37923K5150J060 B37933K5000B470 B37923K5150J070 B37933K5000B560 B37923K5180J060 B37933K5000B570 B37923K5180J070 B37933K5000B660 B37923K5220J060 B37933K5000B670 B37923K5220J070 B37933K5000B760 B37933K5000B770 B37933K5000B860 B37933K5000B870 B37933K5000B960 B37933K5000B970 B37933K5010B060 B37933K5010B070 B37933K5010B260 B37933K5010B270 B37933K5010B560 B37933K5010B570 B37933K5010B860 B37933K5010B870 B37933K5020B260 B37933K5020B270 B37933K5020B760 B37933K5020B770 B37933K5030B360 B37933K5030B370 B37933K5030B960 B37933K5030B970 B37933K5040C760 B37933K5040C770 B37933K5050C660 B37933K5050C670
Substitute Product
Date of Withdrawal 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26
Deadline Last Orders 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30
Last Shipments 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31
Ordering Code B37933K5060C860 B37933K5060C870 B37933K5080C260 B37933K5080C270 B37933K5100J060 B37933K5100J070 B37933K5120J060 B37933K5120J070 B37933K5150J060 B37933K5150J070 B37933K5180J060 B37933K5180J070 B37933K5220J060 B37933K5220J070 B37933K5270J060 B37933K5270J070 B37933K5820J060 B37933K5820J070 B37923K5000B360 B37923K5000B370 B37923K5000B460 B37923K5000B470 B37923K5000B560 B37923K5000B570 B37923K5000B660 B37923K5000B670 B37923K5000B760 B37923K5000B770 B37923K5000B860 B37923K5000B870 B37923K5000B960 B37923K5000B970 B37923K5010B060 B37923K5010B070 B37923K5010B260 B37923K5010B270 B37923K5010B560 B37923K5010B570
Substitute Product
Date of Withdrawal 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26
Deadline Last Orders 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30
Last Shipments 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31
Ordering Code B37923K5010B860 B37923K5010B870 B37923K5020B260 B37923K5020B270 B37923K5020B760 B37923K5020B770 B37923K5030B360 B37923K5030B370 B37923K5030B960 B37923K5030B970 B37923K5040C760 B37923K5040C770 B37923K5050C660 B37923K5050C670 B37923K5060C860 B37923K5060C870 B37923K5080C260 B37923K5080C270 B37923K5100J060
Substitute Product
Date of Withdrawal 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26
Deadline Last Orders 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30
Last Shipments 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31
For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales.
Multilayer ceramic capacitors HQF
Chip
HQF Ordering code system
B37923
Type and size Chip size (inch/mm) = Temperature characteristic HQF 0402/1005 B37923 0603/1608 B37933 Termination Standard: K nickel barrier for all case sizes Rated voltage 5 (Code) 50 VDC Capacitance, coded (example) 100 10 100 pF = 10 pF
K
5
100
J
0
60
Capacitance tolerance CR < 10 pF: B 0.1 pF (standard for capacitance values 3.9 pF) C 0.25 pF (standard for capacitance values 8.2 pF) D 0.5 pF CR 10 pF: F 1% G 2% J 5% (standard) K 10% Decimal place for cap. values < 10 pF, otherwise not used Packaging 60 cardboard tape, 180-mm reel 70 cardboard tape, 330-mm reel
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors HQF
Features Ultra-low ESR and high Q factor Tight capacitance tolerances High stability with respect to time, temperature (TCC: 0 60 ppm/C), frequency and voltage Class 1 characteristic with copper inner electrodes Excellent attenuation High self-resonant frequency Lower power dissipation / Less energy absorption Based on AEC-Q200 Rev-C Applications High-frequency applications Matching circuits Cellular communication, Bluetooth, DECT Cable TV, satellite TV (LNB), GPS, satellite radio Filters, RF amplifiers, VCOs Termination Nickel barrier terminations (Ni) for lead-free soldering Options Alternative capacitance values and tolerances available on request Delivery mode Cardboard tape, 180-mm and 330-mm reel available Electrical data Temperature characteristic Climatic category Standard Dielectric Rated voltage Test voltage Capacitance range Temperature coefficient Dissipation factor Insulation resistance1) Insulation resistance1) Time constant1) Time constant1) Operating temperature range Ageing C0H 55/125/56 EIA Class 1 VR 50 Vtest 2.5 VR/5 s CR 0.3 pF ... 82 pF 0 60 10-6/K tan < 1.0 10-3 Rins > 105 Rins > 104 > 1000 > 100 Top 55 ... +125 none
(IEC 60068-1)
VDC VDC
(limit value) (at +25 C) (at +125 C) (at +25 C) (at +125 C)
M M s s C
1) For CR >10 nF the time constant = C
Rins is given.
Please read Cautions and warnings and Important notes at the end of this document.
Page 3 of 19
Multilayer ceramic capacitors HQF
Capacitance tolerances CR Code letter Tolerance CR 3.9 pF B (standard) 0.1 pF CR 10 pF F 1% C 0.25 pF 4.7 pF CR 8.2 pF B 0.1 pF C (standard) 0.25 pF D 0.5 pF
CR Code letter Tolerance
G 2%
J (standard) 5%
K 10%
Dimensional drawing
Dimensions (mm) Case size l w th k (inch) (mm) 0402 1005 1.0 0.10 0.5 0.05 0.5 0.05 0.1 0.40 0603 1608 1.6 0.15 0.8 0.10 0.8 0.10 0.1 0.40
Tolerances to CECC 32101-801
Please read Cautions and warnings and Important notes at the end of this document.
Page 4 of 19
Multilayer ceramic capacitors HQF
Recommended solder pad
Recommended dimensions (mm) for reflow soldering Case size (inch/mm) 0402/1005 0603/1608 Type single chip single chip A 0.35 ... 0.45 0.6 ... 0.7 C 1.0 ... 1.4 1.8 ... 2.2 D 0.4 ... 0.6 0.6 ... 0.8
Recommended dimensions (mm) for wave soldering Case size (inch/mm) 0603/1608 Type single chip A 0.8 ... 0.9 C 2.2 ... 2.8 D 0.6 ... 0.8
Termination
Please read Cautions and warnings and Important notes at the end of this document.
Page 5 of 19
Multilayer ceramic capacitors HQF
Product range for HQF chip capacitors Size inch (l x w) mm (l x w) Type CR \ VR (VDC) 0.3 pF 0.4 pF 0.5 pF 0.6 pF 0.7 pF 0.8 pF 0.9 pF 1.0 pF 1.2 pF 1.5 pF 1.8 pF 2.2 pF 2.7 pF 3.3 pF 3.9 pF 4.7 pF 5.6 pF 6.8 pF 8.2 pF 10 pF 12 pF 15 pF 18 pF 22 pF 27 pF 82 pF
0402 1005 B37923 50
0603 1608 B37933 50
Please read Cautions and warnings and Important notes at the end of this document.
Page 6 of 19
Multilayer ceramic capacitors HQF
Ordering codes and packing for HQF, 50 VDC, nickel barrier terminations Chip thickness Cardboard tape, 180-mm reel ** 60 pcs./reel 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 10000 Cardboard tape, 330-mm reel ** 70 pcs./reel 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000 50000
CR
Ordering code
mm 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05 0.5 0.05
Case size 0402, 50 VDC 0.3 pF B37923K5000B3** 0.4 pF B37923K5000B4** 0.5 pF B37923K5000B5** 0.6 pF B37923K5000B6** 0.7 pF B37923K5000B7** 0.8 pF B37923K5000B8** 0.9 pF B37923K5000B9** 1.0 pF B37923K5010B0** 1.2 pF B37923K5010B2** 1.5 pF B37923K5010B5** 1.8 pF B37923K5010B8** 2.2 pF B37923K5020B2** 2.7 pF B37923K5020B7** 3.3 pF B37923K5030B3** 3.9 pF B37923K5030B9** 4.7 pF B37923K5040C7** 5.6 pF B37923K5050C6** 6.8 pF B37923K5060C8** 8.2 pF B37923K5080C2** 10 pF B37923K5100J0** 12 pF B37923K5120J0** 15 pF B37923K5150J0** 18 pF B37923K5180J0** 22 pF B37923K5220J0**
Please read Cautions and warnings and Important notes at the end of this document.
Page 7 of 19
Multilayer ceramic capacitors HQF
Ordering codes and packing for HQF, 50 VDC, nickel barrier terminations Chip thickness Cardboard tape, 180-mm reel ** 60 pcs./reel 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 Cardboard tape, 330-mm reel ** 70 pcs./reel 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000
CR
Ordering code
mm 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1
Case size 0603, 50 VDC 0.4 pF B37933K5000B4** 0.5 pF B37933K5000B5** 0.6 pF B37933K5000B6** 0.7 pF B37933K5000B7** 0.8 pF B37933K5000B8** 0.9 pF B37933K5000B9** 1.0 pF B37933K5010B0** 1.2 pF B37933K5010B2** 1.5 pF B37933K5010B5** 1.8 pF B37933K5010B8** 2.2 pF B37933K5020B2** 2.7 pF B37933K5020B7** 3.3 pF B37933K5030B3** 3.9 pF B37933K5030B9** 4.7 pF B37933K5040C7** 5.6 pF B37933K5050C6** 6.8 pF B37933K5060C8** 8.2 pF B37933K5080C2** 10 pF B37933K5100J0** 12 pF B37933K5120J0** 15 pF B37933K5150J0** 18 pF B37933K5180J0** 22 pF B37933K5220J0** 27 pF B37933K5270J0** 82 pF B37933K5820J0**
Please read Cautions and warnings and Important notes at the end of this document.
Page 8 of 19
Multilayer ceramic capacitors HQF
Typical RF performance for HQF capacitors, case size 0402, 50 VDC Capacitance pF 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 fres1) MHz 23400 20350 19700 17400 15100 14450 12600 12000 10600 8900 7100 6400 6000 5500 5350 4650 3950 4100 3650 3350 3350 2600 2300 2200 ESR @ 1 GHz2) m 560 490 440 405 375 355 335 320 295 265 245 225 205 185 170 155 145 130 120 110 102 92 84 78 Q @ 1 GHz2) 920 805 720 650 600 560 520 490 440 390 350 310 275 245 225 200 175 155 140 120 104 88 70 56 ESR @ fres2) m 710 605 535 485 445 415 385 365 330 290 265 235 210 190 175 155 140 125 115 105 94 82 74 66
1) Measured with impedance analyser E4991 A, parts not soldered. 2) Measured with network analyser HP 8753D, parts soldered.
Please read Cautions and warnings and Important notes at the end of this document.
Page 9 of 19
Multilayer ceramic capacitors HQF
Typical RF performance for HQF capacitors, case size 0603, 50 VDC Capacitance pF 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 fres3) MHz 17800 17100 13600 12200 11400 10600 9600 8800 7900 6900 5750 5100 4700 4150 3550 3130 2850 2730 2580 2400 2150 2050 1870 1780 ESR @ 1 GHz4) m 445 400 385 345 325 315 300 275 250 240 215 200 185 175 165 150 140 130 120 110 102 96 88 80 Q @ 1 GHz4) 860 805 755 635 595 560 525 455 395 360 305 270 235 210 185 160 135 115 96 76 62 50 34 26 ESR @ fres4) m 595 540 510 440 410 390 365 335 300 285 250 235 210 200 185 170 155 140 130 118 108 100 90 82
Capacitance pF 82
fres3) MHz 930
ESR @ 1 GHz4) m 52
Q @ 1 GHz4) 105
ESR @ fres4) m 52
3) Measured with impedance analyser E4991 A, parts not soldered. 4) Measured with network analyser HP 8753D, parts soldered.
Please read Cautions and warnings and Important notes at the end of this document.
Page 10 of 19
Multilayer ceramic capacitors HQF
Typical characteristics for case size 04021) ESR versus capacitance C (for not soldered parts)
ESR versus capacitance C at self-resonant frequency (for soldered parts)
ESR versus frequency f
Self-resonant frequency fres versus capacitance C
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and Important notes at the end of this document.
Page 11 of 19
Multilayer ceramic capacitors HQF
Typical characteristics for case size 04021) Q factor versus capacitance C
Q factor versus frequency f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and Important notes at the end of this document.
Page 12 of 19
Multilayer ceramic capacitors HQF
Typical characteristics for case size 06031) ESR versus capacitance C (for not soldered parts)
ESR versus capacitance C at self-resonant frequency (for soldered parts)
ESR versus frequency f
Self-resonant frequency fres versus capacitance C
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and Important notes at the end of this document.
Page 13 of 19
Multilayer ceramic capacitors HQF
Typical characteristics for case size 06031) Q factor versus capacitance C
Q factor versus frequency f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and Important notes at the end of this document.
Page 14 of 19
Multilayer ceramic capacitors HQF
Cautions and warnings How to select ceramic capacitors Remember the following when selecting ceramic capacitors: 1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on AEC-Q200 Rev-C. 2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp 15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors should be connected in series. Alternatively a ceramic capacitor with integrated series circuits should be used in order to reduce the possibility of a short circuit caused by a fracture. The MLSC from EPCOS contains such a series circuit in a single component. 3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter "Effects on mechanical, thermal and electrical stress", section 1.4). 4. Additional stress factors such as continuous operating voltage or application-specific derating must be taken into account in the selection of components (refer to chapter "Reliability"). Recommendations for the circuit board design 1. Components with an optimized geometrical design are preferable where permitted by the application. 2. Use at least FR4 circuit board material. 3. Geometrically optimized circuit boards are preferable, especially those that cannot be deformed. 4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a circuit board. High bending forces may be exerted there when boards are separated and during further processing of a board (e.g. when incorporating it in a housing). 5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit board. 6. Screw connections should not be used to fix a board or connect several boards. Components should not be placed near screw holes. If screw connections are unavoidable, they should be cushioned, for instance using rubber pads.
Please read Cautions and warnings and Important notes at the end of this document.
Page 15 of 19
Multilayer ceramic capacitors HQF
Recommendations for processing 1. Ensure correct positioning of a ceramic capacitor on the solder pad. 2. Be careful when using casting, injection-molded and molding compounds and cleaning agents. They can damage a capacitor. 3. Support a circuit board and reduce placement forces. 4. Do not straighten a board (manually) if it is distorted by soldering. 5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or breaking). 6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or snap-in components) because of the danger of bending and fracture. 7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that components are not damaged. 8. Avoid excessive force when plugging a connector into a device soldered onto a board. 9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is permissible for them (see chapter "Soldering directions"). 10. When soldering, select the softest solder profile possible (heating time, peak temperature, cooling time) to avoid thermal stress and damage. 11. Ensure the correct solder meniscus height and solder quantity. 12. Ensure correct dosing of the cement. 13. Ceramic capacitors with external silver-palladium terminations are intended for conductive adhesion - they are not suited for lead-free soldering processes.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and Important notes at the end of this document.
Page 16 of 19
Multilayer ceramic capacitors HQF
Symbols and terms Symbol A C C0 C1 CR C20 C25 C D Ea ESR F f fmeas fres Itest k L N Ploss Qel Q Rins RP RS SV T Tmeas Top Tref Ttest t tr ttest tan English Area Capacitance Initial (original) capacitance Capacitance value after one hour's use Rated capacitance Capacitance at 20 C Capacitance at 25 C Capacitance change Bending displacement Activation energy Equivalent series resistance Force Frequency Measuring frequency Self-resonant frequency Test current Ageing constant Inductance Quantity (integer values) Power dissipation or loss Electrical charge Quality Insulation resistance Parallel resistance Series resistance (circuit resistance) Rate of rise of a voltage pulse Temperature Measuring temperature Operating temperature Reference temperature Test temperature Time Rise time of a voltage pulse Test duration Dissipation factor German Flache Kapazitat Anfangskapazitat Kapazitatswert nach einer Stunde Nennkapazitat Kapazitat bei 20 C Kapazitat bei 25 C Kapazitatsanderung Durchbiegung Aktivierungsenergie Ersatzserienwiderstand Kraft Frequenz Messfrequenz Eigenresonanzfrequenz Prufstrom Alterungskonstante Induktivitat Anzahl (ganzzahliger Wert) Verlustleistung Elektrische Ladung Gute Isolationswiderstand Parallelwiderstand Serienwiderstand Flankensteilheit eines Spannungsimpulses Temperatur Messtemperatur Betriebstemperatur Bezugstemperatur Pruftemperatur Zeit Anstiegszeit eines Spannungsimpulses Prufdauer Verlustfaktor
Page 17 of 19
Please read Cautions and warnings and Important notes at the end of this document.
Multilayer ceramic capacitors HQF
Symbol V V0 Vmeas VR VS VRMS Vtest |Z| 0 r
English Voltage Initial (original) voltage (basic voltage level) Measuring voltage Rated voltage Amplitude of a voltage pulse Measuring (root-mean-square or effective) AC voltage Test voltage Magnitude of impedance (AC resistance) Temperature coefficient Absolute dielectric constant Relative dielectric constant Failure rate Time constant
German Spannung Anfangsspannung (Spannungsgrundpegel) Messspannung Nennspannung Hub des Spannungsimpulses Effektivspannung Prufspannung Betrag der Impedanz (Wechselstromwiderstand) Temperaturkoeffizient Absolute Dielektrizitatskonstante Relative Dielektrizitatskonstante Ausfallrate Zeitkonstante
Abbreviations / Notes Symbol English Lead spacing (in mm) Surface-mounted devices * + German Rasterma (in mm) Oberflachenmontierbares Bauelement
To be replaced by a number in ordering Platzhalter fur Zahl im Bestellnummerncodes, type designations etc. code oder fur die Typenbezeichnung. To be replaced by a letter. All dimensions are given in mm. The commas used in numerical values denote decimal points. Platzhalter fur einen Buchstaben. Alle Mae sind in mm angegeben. Verwendete Kommas in Zahlenwerten bezeichnen Dezimalpunkte.
Please read Cautions and warnings and Important notes at the end of this document.
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Important notes
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.
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